Effect of Discharge Power and Pressure on Deposition Rate of Metallic Films in DC Magnetron Sputtering System
Abstract
The effect of discharge power and pressure on deposition rate of Cu, Al, and Ti films in dc magnetron sputtering has been investigated using the quartz crystal microbalance technique. The investigated range of the discharge power is 10-200 W, while the argon pressure is in the range of 5-30 mTorr. The measurements show that the deposition rate of Cu is higher than that of Al and Ti. Furthermore, the deposition rate tends to increase with discharge power but decreases with argon pressure. In order to interpret the results, a mathematical model has been proposed taking into account sputtering at the target surface and collisions in a gas phase. The calculations using the model agree well with the measurements. It is found that the sputtering yield of the target as well as the flux and energy of the sputtering particles are crucial to determine the deposition rate. Furthermore, the decrease of deposition rate as the pressure increases can be explained in terms of collisions between sputtered and gas particles. Keywords : deposition rate, metallic films, dc magnetron sputteringReferences
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Biersack, J., & Haggmark, L. (1980). A Monte Carlo computer program for the transport of energetic ions in amorphous targets. Nuclear Instruments and Methods, 174, 257-269.
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New Jersey: John Wiley & Sons.
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Rahmane, S., Djouadi, M., Aida, M., Barreau, N., Abdallah, B., & Hadj Zoubir, N. (2010). Power and pressure effects upon magnetron sputtered aluminum doped ZnO films properties. Thin Solid Films, 519, 5-10.
Slater, J. (1964). Atomic Radii in Crystals. The Journal of Chemical Physics, 41, 3199-3204.
Tanaka, T., Suzuki, M., & Kawabata, K. (1999). Effect of DC bias on the deposition rate using RF-DC coupled magnetron sputtering for Mg thin films. Thin Solid Films, 343-344, 57-59.
Wasa, K., Kanno, I., & Kotera, H. (2012). Handbook of Sputter Deposition Technology: Fundamentals and Applications for Functional Thin Films, Nano-materials and MEMS. William Andrew.
Yamamura, Y. (1981). Contribution of anisotropic velocity distribution of recoil atoms to sputtering yields and angular distributions of sputtered atoms. Radiation Effects, 55, 49-55.
Ziegle, F., & Biersack, J. (2013). Monte Carlo code SRIM2013. Retrieved 2016, from http://srim.org.
J. Vac. Sci. Technol. A, 28, 783-790.
Biersack, J., & Haggmark, L. (1980). A Monte Carlo computer program for the transport of energetic ions in amorphous targets. Nuclear Instruments and Methods, 174, 257-269.
Depla, D., Li, X., Mahieu, S., & Gryse, R. (2008). Determination of the effective electron emission yields of compound materials. Journal of Physics D: Applied Physics, 41, 202003.
Duygulu, N., & Kodolbas, A. O. (2016). Investigation of DTS effect on r.f. magnetron sputtered ZnO thin films. Cryst. Res. Technol., 51, 189-196.
Ekpe, S., Bezuidenhout, L., & Dew, S. (2005). Deposition rate model of magnetron sputtered particles.
Thin Solid Films, 474, 330-336.
Furuya, A., & Hirono, S. (1990). Target magneticfield effects on deposition rate in rf magnetron sputtering. Journal of Applied Physics, 68, 304-310.
Gudmundsson, J., & Hecimovic, A. (2017). Foundations of DC plasma sources. Plasma Sources Science and Technology, 26, 123001.
Helmersson, U., Lattemann, M., Bohlmark, J., Ehiasarian, A., & Gudmundsson, J. (2006). Ionized physical vapor deposition (IPVD): A review of technology and applications. Thin Solid Films, 513, 1 - 24.
Lieberman, M., & Lichtenberg, A. (2005). Principles of Plasma Discharges and Materials Processing.
New Jersey: John Wiley & Sons.
Liu, X., Li, Y., Tao, B., Luo, A., & He, S. (2002). The effect of deposition rate on the microstructure of YBCO thin films prepared by inverted cylindrical magnetron sputtering. Physica C: Superconductivity, 371, 133–138.
Rahmane, S., Djouadi, M., Aida, M., Barreau, N., Abdallah, B., & Hadj Zoubir, N. (2010). Power and pressure effects upon magnetron sputtered aluminum doped ZnO films properties. Thin Solid Films, 519, 5-10.
Slater, J. (1964). Atomic Radii in Crystals. The Journal of Chemical Physics, 41, 3199-3204.
Tanaka, T., Suzuki, M., & Kawabata, K. (1999). Effect of DC bias on the deposition rate using RF-DC coupled magnetron sputtering for Mg thin films. Thin Solid Films, 343-344, 57-59.
Wasa, K., Kanno, I., & Kotera, H. (2012). Handbook of Sputter Deposition Technology: Fundamentals and Applications for Functional Thin Films, Nano-materials and MEMS. William Andrew.
Yamamura, Y. (1981). Contribution of anisotropic velocity distribution of recoil atoms to sputtering yields and angular distributions of sputtered atoms. Radiation Effects, 55, 49-55.
Ziegle, F., & Biersack, J. (2013). Monte Carlo code SRIM2013. Retrieved 2016, from http://srim.org.
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2018-05-16
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